Acta Univ. Agric. Silvic. Mendelianae Brun. 2013, 61(6), 1597-1604 | DOI: 10.11118/actaun201361061597

Soldering sheets using soft solders

Milan Brožek
Department of Material Science and Manufacturing Technology, Faculty of Engineering, Czech University of Life Sciences Prague, Kamýcká 129, 165 21 Praha 6 - Suchdol, Czech Republic

The paper contains strength tests results of joints soldered using lead and leadless soft solders. For tests lead solders types Pb60Sn40 and Sn60Pb40 and leadless soft solders types Sn95.5Ag3.8Cu0.7 and Sn96Ag4 were used. As basic materials steel sheet, zinc-coated steel sheet, copper sheet and brass sheet 100 x 20 x 1 mm was the test samples size. Always two sheets were cleaned and jointed together. For heating the propane-butane + air flame was used. Then the tested assemblies were loaded using the universal tensile-strength testing machine till to failure. At the tests the force needed for assemblies failure and failure type (in soldered joint, in basic material) were recorded. From measured data the solder strength was calculated. From the experiment results it follows that from the point of view of the soldered joints strength as well of the solder strength relatively small differences were found. At the same time it is evident that the joint strength and solder strength depend on soldered material type and on soldered joint lapping length. On the basis of carried out experiments it can be stated that the substitution of lead solders by leadless solders is possible without risk of soldered joints strength decrease.

Keywords: soldered joints, leadless solders, laboratory tests, tensile lap-shear strength
Grants and funding:

Supported by the Internal Grant Agency of the Czech University of Life Sciences Prague, Czech Republic, Project No. 31140/1312/3107.

Received: September 18, 2013; Published: November 24, 2013  Show citation

ACS AIP APA ASA Harvard Chicago IEEE ISO690 MLA NLM Turabian Vancouver
Brožek, M. (2013). Soldering sheets using soft solders. Acta Universitatis Agriculturae et Silviculturae Mendelianae Brunensis, 61(6), 1597-1604. doi: 10.11118/actaun201361061597
Share...
Download citation
  • BibTeX (.bib)
  • Bookends (.ris)
  • EasyBib (.ris)
  • EndNote (.enw)
  • EndNote 8 (.xml)
  • ISI WoS (.isi)
  • Medlars (.medlars)
  • Mendeley (.ris)
  • MODS (.xml)
  • Papers (.ris)
  • RefWorks (.txt)
  • RefManager (.ris)
  • RIS (.ris)
  • MS Word (.xml)
  • Zotero (.ris)
    • Open full article

    References

    1. ABEL, M., CIMBUREK, V., 2005: Bezolovnaté pájení v legislativě i praxi (Lead-free soldering in legislature and practice). Pardubice: ABE.TEC. 179 s. ISBN 80-903597-0-1. In Czech.
    2. ABTEW, M., SELVADURAY, G., 2000: Lead-free solders in microelectronics. Materials Science and Engineering R: Reports. 27, 5: 95-141. ISSN 0927-796X. DOI: 10.1016/S0927-796X(00)00010-3 Go to original source...
    3. BLAŠČÍK, F. et al., 1988: Technológia tvárnenia, zlievárenstva a zvárania (Technology of forming, founding and welding). Bratislava: ALFA. 830 s. ISBN N. In Czech and Slovak.
    4. BROŽEK, M., 2013a: Technical-economical evaluation of plywood bonding. In: 5th International Conference Trends in Agricultural Engineering 2013. 3-6 September, 2013. Prague: Czech University of Life Sciences Prague, 100-105. ISBN 978-80-213-2388-9.
    5. BROŽEK, M., 2013b: Soldering steel sheets using soft solders. Research in Agriculture Engineering, 59. ISSN 1212-9151. (In press). Go to original source...
    6. BROŽEK, M., 2014: Optimization of adhesive layer thickness at metal bonding using quick-setting adhesives. Manufacturing technology, 14. ISSN 1213-2489. (In press). Go to original source...
    7. BROŽEK, M., 2007: Technicko-ekonomické hodnocení aplikace návarů u plužních čepelí (Technical-economical evaluation of the overlays application on the plough shares). Acta Univ. Agric. et Silvic. Mendel. Brun., 55, 4: 129-136. In Czech. ISSN 1211-8516. DOI: 10.11118/actaun200755040129 Go to original source...
    8. BROŽEK, M., NOVÁKOVÁ, A., 2009: Soldering of steel using soft solders. In: 8th International Scientific Conference Engineering for Rural Development. 28-29 May, 2009. Latvia: Jelgava, 315-318. Available online: (http://tf.llu.lv/conference/proceedings2009). ISSN 1691-5976.
    9. GLAZER, J., 1995: Metallurgy of low temperature Pb-free solders for electronic assembly. International Materials Reviews, 40, 2: 65-93. ISSN 0950-6608. DOI: 10.1179/095066095790151115 Go to original source...
    10. CHLUSTINOVÁ, E., 2009: Hodnocení pevnosti spojů pájených měkkými pájkami (Evaluation of joints strength soldered using soft solders). Diploma thesis, Department of Material Science and Manufacturing Technology, Czech University of Life Sciences Prague, Prague: 68. In Czech.
    11. KAŠPAR, Z., 2005: Lepení konstrukčních materiálů v zemědělství (Bonding of construction materials in agriculture). Ph.D. thesis. Department of Material Science and Manufacturing Technology, Czech University of Life Sciences Prague, Prague: 125. In Czech.
    12. KUCHAŘ, J., 2011: Hodnocení mechanických vlastností spojů pájených olovnatými a bezolovnatými měkkými pájkami (Evaluation of mechanical properties of joints soldered using lead and leadless soft solders). Diploma thesis, Department of Material Science and Manufacturing Technology, Czech University of Life Sciences Prague, Prague: 95. In Czech.
    13. MAHMUDI, R., ESLAMI, M., 2011: Shear strength of the Zn-Sn high-temperature lead-free solders. Journal of Material Science: Materials in Electronics. 22, 8: 1168-1172. ISSN 0957-4522. DOI: 10.1007/s10854-010-0279-4 Go to original source...
    14. MANKO, H. H., 1964: Solder and Soldering. New York: McGraw-Hill. 323 s.
    15. MIRIC, A. Z., GRUSD, A., 1998: Lead-free alloys. Soldering and Surface Mount Technology, 28, 10: 19-25. ISSN 0954-0911. DOI: 10.1108/09540919810203793 Go to original source...
    16. MŰLLER, M., 2006: Lepení kovových a nekovových materiálů (Bonding of metallic and non-metallic materials). Ph.D. thesis. Department of Material Science and Manufacturing Technology, Czech University of Life Sciences Prague, Prague: 123. In Czech.
    17. NIPPES, E. F., 1983: Metals Handbook. Vol. 6, Welding, brazing, and soldering. 9th ed. Metals Park: American Society for Metals: 1152. Available online: https://vufind.techlib.cz/Record/000124202/Description#tabnav.
    18. ROBERTS, P. M., 2004: Industrial brazing practice. Boca Raton: CRC Press. 383 s. ISBN 0-8493-2112-3.
    19. RUŽA, V., 1988: Pájení (Soldering). Praha: Nakladatelství techn. lit., 452 s. In Czech.
    20. SAGANUMA, K., 2001: Advances in lead-free electronics soldering. Current Opinion in Solid State and Materials Science. 5, 1: 55-64. ISSN 1359-0286. DOI: 10.1016/S1359-0286(00)00036-X Go to original source...
    21. WOOD, E. P., NIMMO, K. L., 1994: In search of new lead-free electronics solders. Journal of Electronic Materials. 23, 8: 709-713. ISSN 0361-5235. DOI: 10.1007/BF02651363 Go to original source...
    22. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. http://eur-lex.europa.eu/smartapi/cgi/sga_doc?smartapi!celexapi!prod!CELEXnumdoc=EN#doc=32002L0095&model=guichett. Acessed 16 September 2013.
    23. Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE) - Joint declaration of the European Parliament, the Council and the Commission relating to Article 9. http://eur-lex.europa.eu/smartapi/cgi/sga_doc?smartapi!celexapi!prod!CELEXnumdoc=EN#doc=32002L0096&model=guichett. Acessed 16 September 2013).
    24. Měkké pájky, 2013: (Soft solders). http://www.kovopb.cz/userdata/pages/12/dp-solders.pdf. Acessed 16 September 2013. In Czech and English.

    This is an open access article distributed under the terms of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License (CC BY NC ND 4.0), which permits non-comercial use, distribution, and reproduction in any medium, provided the original publication is properly cited. No use, distribution or reproduction is permitted which does not comply with these terms.


    Return to the content